JCET

Changdian Technology was founded in 1972 and successfully listed on the main board of Shanghai Stock Exchange in 2003.  After more than 40 years of development, Changdian Technology has become a world-renowned integrated circuit packaging and testing enterprise.  

Changjiang provides package design, product development and certification, as well as a full range of professional production services from in-chip testing, packaging to finished product testing and shipping.  Long telegram is committed to sustainable development strategy of science and technology, advocating employees, enterprises, customers, shareholders and society harmonious development, the concept of win-win cooperation, has earned a national key high-tech enterprises, China's electronic enterprises, IC packaging technology innovation strategic alliance, chairman of the unit, China's export products quality demonstration enterprises,  It has a national engineering laboratory of high-density integrated circuits, a state-level enterprise technology center, and a post-doctoral research station.  

Changdian's production, research and development and sales network has covered the world's major semiconductor markets.  

We have a wide range of technology accumulation and product solutions, including FAN-OUT EWLB, WLCSP, Bump, POP, FCBGA, SIP, PA and other packaging technologies with independent intellectual property rights. In addition, lead frame packaging and independent brand discrete devices are also highly praised by customers.  

Changdian technology with "respect, tolerance, enterprising, realistic" values to shape the staff, the implementation of "one enterprise, one team, one dream" harmonious family culture, to "not the only, strive to be the first" service concept to make every effort to satisfy customers.  

Main Products:  

Wafer level packaging, system level packaging, flip, substrate packaging, lead frame packaging, discrete devices